Active Power Device Selection in High- and Very-High-Frequency Power Converters

Journal
IEEE TPELS
Author

G. Zulauf, Z. Tong, J. D. Plummer and J. M. Rivas-Davila,

Published

November 28, 2018

Doi
Abstract
This paper aims to provide a road map for selecting power devices in soft-switched, megahertz (MHz) frequency power converters. Minimizing C OSS losses, which occur when charging and discharging the parasitic output capacitor of power semiconductors, is critical to efficient operation. These losses are excluded from manufacturer-provided information, and measurements are either sparse or not reported at all in the existing literature. We report the first high-frequency C OSS loss data from silicon carbide (SiC) power MOSFETs, with a range of devices tested from 1 to 35 MHz and up to 800 V. In contrast to GaN HEMTs, C OSS losses in SiC MOSFETs do not increase with dV/dt at these frequencies. A total of 3%-10% of the stored energy is dissipated in the measured SiC MOSFETs. We report new C OSS loss measurements for vertical silicon MOSFETs and expand on existing measurements for superjunctions, finding high variance in C OSS losses between devices for both constructions. High C OSS losses preclude the tested silicon MOSFETs from efficient operation at MHz frequencies. Lastly, we compare devices in soft-switched applications using a loss calculation that includes these COSS losses, and demonstrate a 100 W, 17 MHz dc-RF inverter using a custom-packaged SiC MOSFET.

Power dissipation of selected devices across frequency and current. Contour lines are constant power dissipation, with the labels showing PDISS, calculated by (8), in watts. Solid line tracks equal PDISS, with arrows showing the preferred device on each side. Assumed waveform is shown in Fig. 13(a). (a) 400 VDS, GS66502B (dashed) and GE1700903A1 (dotted). (b) 650 VDS, GS66502B (dashed) and GE1700903A1 (dotted). (c) 400 VDS, GS66506T (dashed) and SCT3120AL (dotted). (d) 650 VDS, GS66506T (dashed) and SCT3120AL (dotted).