Doctoral Dissertation
Wide-bandgap semiconductors for next-generation power electronics systems
Wide-bandgap power semiconductors promise to reshape the power electronics landscape, opening completely new use cases and increasing efficiency and power density in existing ones. Most notably, gallium nitride (GaN) and silicon carbide (SiC) were successfully commercialized in the past decades, with theoretical benefits over silicon of multiple orders-of-magnitude. When combined with soft-switching techniques and topologies, these wide-bandgap materials have the potential to move power conversion to MHz operating frequencies, radically shrinking power converters and enabling new fabrication methods with the frequency-driven reduction of passive component requirements. Unfortunately, soft-switched converters built at MHz frequencies have consistently underperformed their modeled efficiency, as this work shows for three DC-RF inverters at high- and very-high-frequency. These inverters have measured semiconductor losses nearly an order-of-magnitude greater than expected from manufacturer-provided simulation models, a discrepancy that demands investigation. These losses are attributed to the process of resonantly charging and discharging the output capacitance (Coss) of the power semiconductors, a loss mechanism termed “soft-switching losses” or “Coss losses.” Our measurements constitute the first recognition of this problem in GaN HEMTs, and these initial measurements are then extended to SiC and Si MOSFETs, finding dependencies and scaling laws for each device class. To complete the understanding of losses at high-frequencies, the well-understood phenomenon in GaN HEMTs of dynamic on-resistance is then revisited. Our work conclusively shows that dynamic on-resistance cannot be accurately characterized using the standardized double-pulse-test, and uses the underlying physics to determine the parameters that must be controlled for accurate reporting. Using this measurement framework, this work extends the dynamic on-resistance measurements to MHz frequencies for the first time, finding that the majority of the dynamic effects in soft-switched converters occur below 1 MHz for the tested device. With both off-state and on-state losses precisely understood at MHz frequencies, the promise of high-frequency power conversion can finally be realized. While adopted widely in cell phones, inductive wireless power transfer for higher-value applications (e.g. electric vehicles) is beset by both low performance and high cost due to the limitations of litz wire. At 6.78 MHz, the first international industrial, scientific, and medical (ISM) band above 200 kHz, litz wire can be completely eliminated, paving the way to low cost, small, light, and high-performance systems. A 1 kW DC-DC converter that transfers power across a 2 cm gap with 6.6 cm diameter coils at over 95% efficiency is demonstrated, a new benchmark in power density and efficiency for MHz-frequency wireless power transfer. This performance would, plainly, not have been possible without the identification and quantification of Coss losses. Our future power, transportation, and computing infrastructures are dependent on the implementation of wide-bandgap power semiconductors to reduce size, weight, and cost while increasing efficiency to address the climate challenge. This thesis is our small contribution to meaningfully improving these semiconductors and showing what’s possible for the next generation of power conversion.
Publications
- Small- and Large-Signal Dynamic Output Capacitance and Energy Loss in GaN-on-Si Power HEMTs ∙ IEEE TED ∙ 2021
- Design and Optimization of 6.78 MHz Wireless Power Transfer with Self-Resonant Coils ∙ IEEE COMPEL ∙ 2020
- 1 kW, Multi-MHz Wireless Charging for Electric Transportation ∙ IEEE COMPEL ∙ 2020
- A physical investigation of large-signal dynamic output capacitance and energy loss in GaN-on-Si power HEMTs at high-frequency applications ∙ IEEE ECCE ∙ 2020
- 6.78-MHz Wireless Power Transfer With Self-Resonant Coils at 95% DC–DC Efficiency ∙ IEEE TPELS ∙ 2020
- The Impact of Multi-MHz Switching Frequencies on Dynamic On-Resistance in GaN-on-Si HEMTs ∙ IEEE OJPE ∙ 2020
- Push–Pull Class Φ2 RF Power Amplifier ∙ IEEE TPELS ∙ 2020
- High-Frequency Bidirectional Resonant Converter for High Conversion Ratio and Variable Load Operation ∙ IEEE JESTPE ∙ 2019
- Single-Turn Air-Core Coils for High-Frequency Inductive Wireless Power Transfer ∙ IEEE TPELS ∙ 2019
- An Investigation into the Causes of COSS Losses in GaN-on-Si HEMTs ∙ IEEE COMPEL ∙ 2019
- Output Capacitance Loss Characterization of Silicon Carbide Schottky Diodes ∙ IEEE JESTPE ∙ 2019
- Substrate Bias Effect on E-Mode GaN-on-Si HEMT Coss Losses ∙ IEEE WiPDA ∙ 2018
- Coss Measurements for Superjunction MOSFETs: Limitations and Opportunities ∙ IEEE TED ∙ 2018
- Active Power Device Selection in High- and Very-High-Frequency Power Converters ∙ IEEE TPELS ∙ 2018
- A Study on Off-State Losses in Silicon-Carbide Schottky Diodes ∙ IEEE COMPEL ∙ 2018
- Estimating the Reliability of Series-Connected Schottky Diodes for High-Frequency Rectification ∙ IEEE COMPEL ∙ 2018
- Considerations for Active Power Device Selection in High- and Very-High-Frequency Power Converters ∙ IEEE COMPEL ∙ 2018
- High-Frequency Bidirectional Resonant Converter for High Conversion Ratio and Variable Load Operation ∙ IEEE COMPEL ∙ 2018
- Coss losses in silicon superjunction MOSFETs across constructions and generations ∙ IEEE ISPSD ∙ 2018
- COSS Losses in 600 V GaN Power Semiconductors in Soft-Switched, High- and Very-High-Frequency Power Converters ∙ IEEE TPELS ∙ 2018
- Output capacitance losses in 600 V GaN power semiconductors with large voltage swings at high- and very-high-frequencies ∙ IEEE WiPDA ∙ 2017
- A unified model for high-power, air-core toroidal PCB inductors ∙ IEEE COMPEL ∙ 2017